| Age | Commit message (Collapse) | Author |
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* Moved via that was unreasonably close to another one
* Changed 13V8 diodes to SM5819PL-TP
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* Chose ferrite beads for IC Vcc (BLM31KN102SH1L)
* Change hacking pad thickness to 0.8mm
* Fixed potential oscillator when grounding audio- lines
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* Redo layout
* Fixed MAX pulldown resistors on data lines.
* Added jumpers in case MAX not installed.
* Remove audio header
* Remove some redundant solder jumpers
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* Added initial placement
* Remove pull-down resistors from USB lines.
* Remove ferrite bead from FTDI chip as it was very close to Vcc FB
* Fixed MAX TX pins
* Assigned footprints.
* Removed redundant solder jumpers.
* Small changes for layout coherence.
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* Changed back to USB-B connector.
* Changed value of pull down resistors to 1k.
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* Adjust label position for readability
* Protected R1OUT-R3OUT of MAX driver with OR gate
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